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Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where many IC's can be stacked together using suitable interconnect processes (...
Electroluminescent materials are able to emit light in response to the application of an electrical current or a strong electric field. It is a well-known phenomenon that is also used in rigid, electronic applications an...
Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. Metal ...
The 405nm Laser Diodes industry can be broken down into several segments, Single-Mode 405nm Laser Diode, 405nm Blue Laser Diode, etc.According to our latest study, the global 405nm Laser Diodes market size was valued at ...
Home appliance color-coated sheet is a pre-coated sheet, which is a pre-coated product made of metal coil as the base material and coated or laminated with various organic coatings or plastic films on the surface. The ho...
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